Automotive Application
The trend and requirement of storage in automotive market is growing on navigation and infotainment system, such as HD map, environmental infrastructure , car radio, ADAS, multimedia, E-call and voice recognition. Phison have complete product portfolio which features a full range of JEDEC-compliant packages and scalability in capacity and bandwidth.
Embedded Solutions for Automotive -Overview
Product Strategy
Embedded Storage Roadmap & Adoption
Embedded BGA SSD Introduction
CompactandFlexibleDesignforVariousApplications
•Vitelic μSSD(BGASSD)designisbasedonJEDECstandardwithSATAandPCIe
interfaceforsimplifyingcustomerPCBdesignandenhancingboard-levelreliability.
•Upto256GBofSATAand512GBofPCIewithfullwidetempsupport.CompliantwithIATF16949andJEDEC/JESD-22selected.
•Vitelic μSSD(BGASSD)comeswithIntelligentfirmwarefeaturesaswellasprovisionfo
rcustomizedfirmwaretoenablereliableanddifferentiablesolutions.
Embedded BGA SSD Solutions
S33T BGA SSD | E35TI BGA SSD | |
Illustration |  MP |  CS:Q3’20 |
Interface | SATA III | PCIe Gen3x2 |
Channel | 2 | 4 |
ECC | LDPC | LDPC |
Security encryption | NA | TCG OPAL (Option) |
Flash Support | 15nm MLC 3D TLC | 3D TLC |
Package | 156-Balls - Type 1620 (16 x 20 x 1.4 mm) | 345-Balls - Type 1113 346-(11.5 x 13 mm) |
Capacity | 2D MLC/pSLC: 2~128GB 3D TLC/pSLC: 4~256GB | 3D TLC: 128~512GB |
Performance1 | Up to 550/500 MB/s | Up to 1700/1000 MB/s (Est.)3 |
ThermalSensor | V | V |
pSLC mode2 | V | V |
OPTemp. | Industrial temp.: -40 ~ 85°C | Industrial temp: -40 ~ 85°C |
Certification | IATF16949/PPAP/APQP | |
Embedded eMMCIntroduction
 | Compact and Robust Design for Automotive EmbeddedApplications •Vitelic eMMC is based on JEDEC standard eMMC4.5/5.0/5.1with 153/100balls. It can be mountedfirmly on-board againstvibration. •Page-based firmware reduces latency in system operation, enhancingendurance. •Up to 256GB with AEC-Q100 Qualification for Automotive application. |
Embedded eMMCSolutions
Automotive Embedded (-40~105℃/-40~85℃) | Automotive Embedded (-40~105℃/-40~85℃) | |
Illustration
|  MP: Q2’20 |  MP |
Controller | VL3882 | VL3825 |
eMMCSpecification | eMMC 5.1 | eMMC 5.0 |
ECC | LDPC | BCH |
Channel | 1 | 1 |
FlashSupport | 3D TLC/pMLC/pSLC | 15nm MLC/pSLC |
Package | 153ball-(11.5 x 13.0 x 1.2mm) | 153ball- (11.5 x 13.0 x 1.2mm) 100ball-(14.0 x 18.0 x 1.4mm) |
Capacity | 4GB~256GB | 2GB~64GB |
Performance4 | 280/110 MB/s | 250/120 MB/s |
Features | Support HS400/CMDQ FFU1/PSA2/PON3 | Support HS400 FFU1/PSA2/PON3 |
Compliance | AEC-Q100 IATF16949 ISO262625 | AEC-Q100 IATF16949 |
Embedded UFS for Automotive/Industrial
VL3317 Embedded UFS
High Performance Mobile-based Storage for Embedded/Automotive
Controller (Process) | VL3317 (TSMC 28nm) |
Host supply power | VCCQ (VCCQ2) 1.8v/1.2v , VCC 3.3v/2.5v |
Host Interface | M-PHY 4.1, UniPro 1.8, UFS 3.1 Up to HS-Gear 4B (12Gbps) x 2-Lanes |
Flash Interface | 2 Channels (8 CE) , ONFI 4.1 |
Supported Capacities | 64GB ~ 512GB (Base on Mono Die 512Gb) |
Supported NAND Flash | 3D TLC |
ECC Engine | Phison 4th Gen. LDPC |
Sequential Performance1 | Read:1650 MB/s , Write: 800 MB/s |
Random Performance1,2 | Read :82,000 IOPS , Write: 143,000 IOPS |
Vitelic SD NAND is an extension of the memory card, can be directly patches, its internal integration performance of flash controller, compatible with SD agreement, to meet customer design requirements in miniaturization, differentiation, high reliability.
Product advantages:
• Small size: 6*8mm / 6.2*8mm
• Wide capacity coverage: 1/2/4/32/64Gbit
• Based on SLC/ MLC/ TLC design, high reliability, industrial wide temperature grade optional
• BCH/LDPC error correction algorithm, wear average algorithm, standard SD2.0/3.0 interface, ready to play • Interface speed faster than SPI (64Gbit read speed up to 68MB/s, write speed up to 39MB/s)
• Widely used in ST, TI, NXP, MTK, RK, Nuvoton Technology, AllwinnerTechnology and other platforms, covering industrial, vehicle, medical, power, communication and consumer sectors.
Capacity | 1/2/4/32/64Gbit |
Interface | SD2.0/SD3.0 |
Read/write sequentially | up to class10,UHS-1,U3,V30 |
Flash memory | SLC/MLC/TLC |
Working temperature | Commercial grade：-25℃ to +85℃ |
Industrial-grade：-40℃ to +85℃ | |
Package size | LGA8 6x8mm;LGA8 6.2x8mm |
Embedded SD/microSDSolutions
VL3639 | VL3882 | |
Illustration |   MP |   MP |
Interface | SD 6.X/ UHS-I | |
W x L x H | 11.0 x 15.0 x 1.0mm (microSD) 24.0 x 32.0 x 2.1mm (SD) | |
Channel | 2 | 1 |
ECC | BCH | SECC |
Capacity | SLC: 128MB~32GB MLC: 4~128GB | 3D TLC: 16GB ~ 256GB pSLC of 3D TLC: 4GB ~ 64GB |
Performance1 | SLC up to 65/55 MB/s MLC up to 95/90 MB/s | Up to 95/85 MB/s |
OP Temp | Wide temp: -40~ 85 °C; Standard temp -25~ 85 °C | |
Features |
•SMARTtool •pSLC (PesudoSLC) •Power Loss Protection •Advanced Wear-Leveling •Auto-Read Refresh •CPRM Optional2 |
•SMART tool •pSLC (PesudoSLC) •Power Loss Protection •Advanced Wear-Leveling •Auto-Read Refresh •ReadVerify function for TLC mode •CPRM Optional2 |
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Rm.1902, Easey Comm. Bldg., 253-261 Hennessy Road,Wanchai, Hong Kong
Tel: 00852-3610 2665
Fax: 00852-3610 2665
Email: vitelic@cn-efficient.com
Floor 8, Block AB, Tianji Building, Tianan Digital City, Futian District, Shenzhen
Tel: 86-0755-83823006
Fax: 86-0755-83826783
Email: vitelic@cn-efficient.com